Shape Memory Alloy-Based Spring Bundle Actuator Controlled by Water Temperature

出版年份 2019 全文链接

标题

作者

关键词

出版物

Volume 24, Issue 4, Pages 1798-1807

出版商

Institute of Electrical and Electronics Engineers (IEEE)

发表日期

2019-07-16

DOI

10.1109/tmech.2019.2928881

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