Electromagnetic, Thermal, and Mechanical Quench Simulation of NI REBCO Pancake Coils for High Magnetic Field Generation

出版年份 2019 全文链接

标题

作者

关键词

出版物

Volume 29, Issue 5, Pages 1-7

出版商

Institute of Electrical and Electronics Engineers (IEEE)

发表日期

2019-03-12

DOI

10.1109/tasc.2019.2904317

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