Tailoring interface structure and enhancing thermal conductivity of Cu/diamond composites by alloying boron to the Cu matrix

标题
Tailoring interface structure and enhancing thermal conductivity of Cu/diamond composites by alloying boron to the Cu matrix
作者
关键词
Metal matrix composites (MMCs), High-resolution electron microscopy, Interface structure, Thermal conductivity
出版物
MATERIALS CHARACTERIZATION
Volume 152, Issue -, Pages 265-275
出版商
Elsevier BV
发表日期
2019-04-12
DOI
10.1016/j.matchar.2019.04.015

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