4.6 Article

Secondary pool boiling effects

期刊

APPLIED PHYSICS LETTERS
卷 108, 期 5, 页码 -

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AMER INST PHYSICS
DOI: 10.1063/1.4941081

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资金

  1. Nebraska Center for Energy Sciences Research (NCESR) Grant [803, A-00-A-03]
  2. NASA EPSCoR Grant [2014-198-SC1]
  3. NASA Space Technology Research Fellowship (NSTRF) Grant [NNX14AM50H]
  4. Office of Naval Research (ONR) Grant [FA4600-12-D-9000-0045]

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A pool boiling phenomenon referred to as secondary boiling effects is discussed. Based on the experimental trends, a mechanism is proposed that identifies the parameters that lead to this phenomenon. Secondary boiling effects refer to a distinct decrease in the wall superheat temperature near the critical heat flux due to a significant increase in the heat transfer coefficient. Recent pool boiling heat transfer experiments using femtosecond laser processed Inconel, stainless steel, and copper multiscale surfaces consistently displayed secondary boiling effects, which were found to be a result of both temperature drop along the microstructures and nucleation characteristic length scales. The temperature drop is a function of microstructure height and thermal conductivity. An increased microstructure height and a decreased thermal conductivity result in a significant temperature drop along the microstructures. This temperature drop becomes more pronounced at higher heat fluxes and along with the right nucleation characteristic length scales results in a change of the boiling dynamics. Nucleation spreads from the bottom of the microstructure valleys to the top of the microstructures, resulting in a decreased surface superheat with an increasing heat flux. This decrease in the wall superheat at higher heat fluxes is reflected by a hook back of the traditional boiling curve and is thus referred to as secondary boiling effects. In addition, a boiling hysteresis during increasing and decreasing heat flux develops due to the secondary boiling effects. This hysteresis further validates the existence of secondary boiling effects. (C) 2016 AIP Publishing LLC.

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