期刊
CORROSION SCIENCE
卷 158, 期 -, 页码 -出版社
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.corsci.2019.108101
关键词
Copper; TEM; EIS; XPS; passive films
资金
- Council of Scientific and Industrial Research (CSIR), India [22/FF/CSIR-TWAS/2016]
- World Academy of Sciences (TWAS), Italy [22/FF/CSIR-TWAS/2016]
- Science and Engineering Research Board, DST India under the Extramural Research (EMR) funding scheme [EMR/2016/003316]
We report for the first time, the role of capping agent and size effect of nickel tungstate (NiWO4) nanomaterials (NTN) in mitigation of copper corrosion in chloride medium. NTN were synthesized firstly, via a simple wet-chemical precipitation route without any capping agents (conventional process) and secondly with citric acid as capping agent, both in the presence of sodium tungstate (Na2WO4). Electrochemical analyses for corrosion protection have been tested and results indicated an improved corrosion protection of copper by the capped particles compared to the uncapped (conventional method) particles. A comparison was also made against Na2WO4 (a commercially available corrosion inhibitor).
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