期刊
METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE
卷 50A, 期 7, 页码 3013-3018出版社
SPRINGER
DOI: 10.1007/s11661-019-05209-w
关键词
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资金
- National Key R&D Program of China [2017YFA0204403]
- Shenzhen Virtual University Park [R-IND1710]
- Innovation and Technology Commission via the Hong Kong Branch of National Precious Metals Material Engineering Research Center
- Research Grants Council of the Hong Kong Special Administrative Region, China [CityU 11247516]
- General Research Fund of Hong Kong [CityU 11247516]
- Shenzhen Science and Technology Innovation Committee [JCYJ20160401100358589]
- Province-Institute/Province-College Cooperation Project [2017IB016]
Because of their high strength and oxidation resistance as well as low cost, Cu micro bonding wires have received increased interests in microelectronic packaging industry. The present work revealed that the coating boundary provided additional strength improvement by blocking dislocation gliding. Furthermore, the greater strain concentration along slip bands introduced larger cracks within the Pd coating layer with coarser grains. The present study provides insights for reliable Pd-coated Cu micro bonding wire processing and bonding applications.
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