Long term evolution of microstructure and stress around tin whiskers investigated using scanning Laue microdiffraction

出版年份 2019 全文链接

标题

作者

关键词

X-ray diffraction, Tin whiskers, Lead-free solder

出版物

ACTA MATERIALIA

Volume 168, Issue -, Pages 210-221

出版商

Elsevier BV

发表日期

2019-02-19

DOI

10.1016/j.actamat.2019.02.021

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