Dry Sintering Meets Wet Silver-Ion “Soldering”: Charge-Transfer Plasmon Engineering of Solution-Assembled Gold Nanodimers From Visible to Near-Infrared I and II Regions

标题
Dry Sintering Meets Wet Silver-Ion “Soldering”: Charge-Transfer Plasmon Engineering of Solution-Assembled Gold Nanodimers From Visible to Near-Infrared I and II Regions
作者
关键词
-
出版物
ANGEWANDTE CHEMIE-INTERNATIONAL EDITION
Volume 55, Issue 46, Pages 14296-14300
出版商
Wiley
发表日期
2016-10-14
DOI
10.1002/anie.201608271

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