Effects of diamond particle size on the formation of copper matrix and the thermal transport properties in electrodeposited copper-diamond composite materials
Effects of diamond particle size on the formation of copper matrix and the thermal transport properties in electrodeposited copper-diamond composite materials
作者
关键词
Electrodeposition, Copper-diamond composites, Thermal transport properties, Microstructure
Find the ideal target journal for your manuscript
Explore over 38,000 international journals covering a vast array of academic fields.
SearchBecome a Peeref-certified reviewer
The Peeref Institute provides free reviewer training that teaches the core competencies of the academic peer review process.
Get Started