Thermal-aware network-on-chips: Single- and cross-layered approaches

标题

作者

关键词

Thermal management, Network-on-chip, System-on-chip, Manycore processors, 3D integration

出版物

Volume 91, Issue -, Pages 61-85

出版商

Elsevier BV

发表日期

2018-09-02

DOI

10.1016/j.future.2018.08.041

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