Fabrication of SiC/Si, SiC/SiO2, and SiC/glass heterostructures via VUV/O3 activated direct bonding at low temperature

标题
Fabrication of SiC/Si, SiC/SiO2, and SiC/glass heterostructures via VUV/O3 activated direct bonding at low temperature
作者
关键词
SiC, Vacuum ultraviolet, Direct bonding, Low temperature
出版物
CERAMICS INTERNATIONAL
Volume 45, Issue 3, Pages 4094-4098
出版商
Elsevier BV
发表日期
2018-10-30
DOI
10.1016/j.ceramint.2018.10.231

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