4.8 Article

Nanostructures Significantly Enhance Thermal Transport across Solid Interfaces

期刊

ACS APPLIED MATERIALS & INTERFACES
卷 8, 期 51, 页码 35505-35512

出版社

AMER CHEMICAL SOC
DOI: 10.1021/acsami.6b12947

关键词

thermal boundary conductance; thermal boundary resistance; solid interfaces; thermal managements; nanostructures

资金

  1. DARPA [D15AP00094]
  2. Notre Dame Center for Research Computing
  3. NSF [TG-CTS100078]

向作者/读者索取更多资源

The efficiency of thermal transport across solid interfaces presents large challenges for modern technologies such as thermal management of electronics. In this paper, we report the first demonstration of significant enhancement of thermal transport across solid interfaces by introducing interfacial nanostructures. Analogous to fins that have been used for macroscopic heat transfer enhancement in heat exchangers, the nanopillar arrays patterned at the interface help interfacial thermal transport by the enlarged effective contact area. Such a benefit depends on the geometry of nanopillar arrays (e.g., pillar height and spacing), and a thermal boundary conductance enhancement by as much as similar to 88% has been measured using the time-domain thermoreflectance technique. Theoretical analysis combined with low-temperature experiments further indicates that phonons with low frequency are less influenced by the interfacial nanostructures due to their large transmissivity, but the benefit of the nanostructure is fully developed at room temperature where higher frequency phonons dominate interfacial thermal transport. The findings from this work can potentially be generalized to benefit real applications such as the thermal management of electronics.

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