Analysis of thermally induced delamination of thermoelectric thin film/substrate system
出版年份 2018 全文链接
标题
Analysis of thermally induced delamination of thermoelectric thin film/substrate system
作者
关键词
-
出版物
INTERNATIONAL JOURNAL OF FRACTURE
Volume 214, Issue 2, Pages 201-208
出版商
Springer Nature America, Inc
发表日期
2018-11-12
DOI
10.1007/s10704-018-0328-1
参考文献
相关参考文献
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