4.6 Article

The Effect of Proton Irradiation in Suppressing Current Collapse in AlGaN/GaN High-Electron-Mobility Transistors

期刊

IEEE TRANSACTIONS ON ELECTRON DEVICES
卷 66, 期 1, 页码 372-377

出版社

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TED.2018.2881325

关键词

Gallium nitride (GaN); high-electronmobility transistor (HEMT); proton irradiation; dynamic ON-resistance

资金

  1. agency Flanders Innovation and Entrepreneurship [HBC.2016.0221]
  2. ON Semiconductor Belgium, Oudenaarde, Belgium [HBC.2016.0221]

向作者/读者索取更多资源

Almost complete suppression of dynamic ON-resistance in AlGaN/GaN high-electron-mobility transistors is obtained by proton irradiation. In this paper, both small and large power transistors are characterized before and after 3-MeV proton irradiation at different fluences. The irradiated devices show a high robustness and for specific fluences unaltered threshold voltage and static ON-resistance. However, for fluences higher than 10(13) cm(-2), the dynamic ON-resistance is almost completely suppressed at 600 V and T = 150 degrees C. After irradiation, a measurable increase in OFF-state leakage current is observed, indicating an increase in the unintentionally doped (UID) GaN layer conductivity. We propose a technology computer-aided design supported model in which this conductivity increase leads to an increased deionization rate, ultimately reducing the dynamic ON-resistance.

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