Article
Multidisciplinary Sciences
Yilin Xu, Pascal Maier, Matthias Blaicher, Philipp-Immanuel Dietrich, Pablo Marin-Palomo, Wladislaw Hartmann, Yiyang Bao, Huanfa Peng, Muhammad Rodlin Billah, Stefan Singer, Ute Troppenz, Martin Moehrle, Sebastian Randel, Wolfgang Freude, Christian Koos
Summary: This paper presents a novel hybrid ECL utilizing 3D-printed photonic wire bonds as intra-cavity coupling elements to overcome technological challenges. The research demonstrates that photonic wire bonds enable low-loss coupling, leading to wide single-mode tuning range, high side mode suppression ratios, and low intrinsic linewidths.
SCIENTIFIC REPORTS
(2021)
Article
Multidisciplinary Sciences
Hamza K. Khattak, Stefan Karpitschka, Jacco H. Snoeijer, Kari Dalnoki-Veress
Summary: The dynamic changes of elastic deformation of soft substrates at a microscale and the decrease of force when the film thickness decreases were studied and explained. The relationship between dissipation intensity and film thickness was discovered.
NATURE COMMUNICATIONS
(2022)
Article
Chemistry, Physical
Stephan Handschuh-Wang, Ben Wang, Tao Wang, Florian J. Stadler
Summary: Liquid and fusible metals have attracted significant attention due to their unique thermophysical properties, such as thermal and electrical conductivity and low phase transition temperature. They are widely used in welding, soldering, and thermal transport. Accurate measurement of surface tension and its temperature coefficient is crucial for these applications. Various measurement methods have been developed, and this review discusses the main principles, reasons for preference, and challenges associated with surface tension measurements of liquid metals.
SURFACES AND INTERFACES
(2023)
Article
Multidisciplinary Sciences
Sheng Lin, Long Zhang, Liang Cong
Summary: This study proposes a method for direct ink write printing of gallium-indium (Ga-In) alloys using micro-vibration-driven extrusion. Micro-vibration reduces the surface tension of Ga-In alloy droplets and avoids the appearance of random droplets during printing. By optimizing suitable micro-vibration parameters, the growth process of droplets is significantly slowed down, allowing for high moldability and improved printability of Ga-In alloy droplets.
SCIENTIFIC REPORTS
(2023)
Article
Engineering, Electrical & Electronic
Yuki Susumago, Chang Liu, Tadaaki Hoshi, Jiayi Shen, Atsushi Shinoda, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima
Summary: This letter introduces a direct Cu bonding technology for three-dimensionally integrating heterogeneous dielets. By using SAP bonding, a large number of dielets can be stacked on thin 3D-IC chiplets. The letter also discusses key technologies to solve the yield issues of SAP bonding.
IEEE ELECTRON DEVICE LETTERS
(2023)
Article
Chemistry, Physical
Ying Meng, Runhua Gao, Xinhua Wang, Sen Huang, Ke Wei, Dahai Wang, Fengwen Mu, Xinyu Liu
Summary: The synergistic effect of oxygen plasma surface activation and wetting has been utilized to achieve void-less bonding of cured polyimides at a low temperature, providing a new pathway for adhesive bonding in 3D integration.
Article
Engineering, Electrical & Electronic
Demin Liu, Po-Chih Chen, Yu-Wei Liu, Han-Wen Hu, Kuan-Neng Chen
Summary: This study developed Cu-Cu direct bonding at low temperature using Cr wetting layer and Au passivation, achieving high quality bonding with ultra-low thermal budget. The bonding mechanism involves Cu atoms diffusing through metal layers to form a new inter-layer without voids, ensuring good electrical performance and high reliability for 3D integration applications.
IEEE ELECTRON DEVICE LETTERS
(2021)
Article
Materials Science, Multidisciplinary
Song Yang, Yongfeng Qu, Ningkang Deng, Kang Wang, Shi He, Yuan Yuan, Wenbo Hu, Shengli Wu, Hongxing Wang
Summary: Surface activated bonding based on argon ion beam irradiation can directly bond Si wafers at room temperature, and proper surface activation treatment duration results in lower surface roughness and higher bonding strength for Si-Si bonding. The formation of an amorphous Si layer at the bonding interface through argon ion beam irradiation contributes to the overall structure of the Si-Si bonding.
MATERIALS RESEARCH EXPRESS
(2021)
Article
Chemistry, Multidisciplinary
Pan Fu, Pei-Nan Ni, Bo Wu, Xian-Zhi Pei, Qiu-Hua Wang, Pei-Pei Chen, Chen Xu, Qiang Kan, Wei-Guo Chu, Yi-Yang Xie
Summary: Metasurface polarization optics consisting of birefringent nano-antennas can be integrated with VCSEL platforms to achieve compact control over the phase and polarization properties of the laser. These integrated vector beams have the potential to revolutionize optical communications, laser manipulation, information encryption, and quantum optics by bypassing the need for multiple optical components and offering versatile functionalities.
ADVANCED MATERIALS
(2023)
Article
Chemistry, Analytical
Jun-Hao Lee, Pin-Kuan Li, Hai-Wen Hung, Wallace Chuang, Eckart Schellkes, Kiyokazu Yasuda, Jenn-Ming Song
Summary: This study used finite element analysis to simulate ultrasonic metal bump direct bonding, finding that the maximum stress of square bumps was greater than that of round bumps and the maximum stress of little square bumps was at least 15% greater than those of little round bumps and big round bumps. An experimental demonstration showed that subtractive lithography etching was the only effective process for bonding, and Ar plasma treatment enhanced joint strength, with actual joint shear strength positively proportional to simulated maximum stress.
Article
Chemistry, Analytical
Jongwon Lee, Jae Yong Lee, Jonghyun Song, Gapseop Sim, Hyoungho Ko, Seong Ho Kong
Summary: This article demonstrates the use of flip-chip microbump bonding technology between indium phosphide (InP) and silicon carbide (SiC) substrates for millimeter-wave wireless communication applications. The process involves various steps such as dielectric passivation, pad metallization, bump formation, dicing, and solder bonding. The bonded InP-to-SiC coplanar waveguide lines show uniform performance and comparable insertion loss values to conventional CPW lines. Additionally, a resonant tunneling diode device is successfully fabricated and characterized.
Article
Chemistry, Multidisciplinary
Xin Yang, Gehong Su, Xin Huang, Jize Liu, Tao Zhou, Xinxing Zhang
Summary: This research demonstrates a method for fabricating room-temperature malleable composites using a noncovalent assembly strategy. The composites exhibit excellent toughness and mechanical strength, and can be programmed and self-healed at room temperature using water vapor stimulation. Additionally, the composites also show metallic luster and potential for thermal dissipation.
Article
Chemistry, Multidisciplinary
Fei Nie, Dongpeng Yan
Summary: This study reports a facile bottom-up solution fabrication process to obtain metal-free supramolecular glasses (SMGs) at the macroscopic scale using L-Histidine and hexamethylenetetramine as building blocks. The chiral SMGs possess color-tunable ultralong room temperature phosphorescence (decay lifetime up to 141.2 ms) and circular polarized luminescence (g factor up to 8.7x10(-3)). The strong hydrogen bonds effectively drive the formation of SMGs, and provide a rigid microenvironment to boost triplet exciton generation. Applications including multicolored displays, visual UV detection, and persistently luminescent thermometer are demonstrated based on the excitation- and temperature-dependent ultralong phosphorescence of the SMGs.
ANGEWANDTE CHEMIE-INTERNATIONAL EDITION
(2023)
Article
Chemistry, Analytical
Henrik Persson, Siwan Park, Michael Mohan, Ka Kit Cheung, Craig A. Simmons, Edmond W. K. Young
Summary: This study presents a method to bond poly(methylmethacrylate) layers to a polyethylene terephthalate porous membrane for creating membrane-based microfluidic devices. The bonding method allows for rapid fabrication of devices without adverse effects on the membrane structure. The bonded devices support long term cell culture and experiments related to barrier and endothelial function.
SENSORS AND ACTUATORS B-CHEMICAL
(2022)
Article
Chemistry, Multidisciplinary
Zsuzsa Sarkany, Fernando Rocha, Anna Bratek-Skicki, Peter Tompa, Sandra Macedo-Ribeiro, Pedro M. Martins
Summary: Liquid-solid and liquid-liquid phase separation (PS) is essential for the formation of functional and disease-associated biological assemblies. This study provides a general kinetic solution to predict the evolution of mass and size of biological assemblies based on phase equilibrium principles. The thermodynamics of protein PS is determined by saturation concentration and critical solubility, while the kinetics involve primary nucleation rate constant and a combined rate constant for growth and secondary nucleation. The formation of a limited number of large condensates can occur without active size control or coalescence phenomena.
Article
Engineering, Manufacturing
Hideto Hashiguchi, Takafumi Fukushima, Mariappan Murugesan, Hisashi Kino, Tetsu Tanaka, Mitsumasa Koyanagi
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
(2019)
Article
Engineering, Electrical & Electronic
Miao Xiong, Zhiming Chen, Yingtao Ding, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
IEEE ELECTRON DEVICE LETTERS
(2019)
Article
Physics, Applied
M. Murugesan, A. Takeuchi, T. Fukushima, M. Koyanagi
JAPANESE JOURNAL OF APPLIED PHYSICS
(2019)
Article
Physics, Applied
Sungho Lee, Rui Liang, Yuki Miwa, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
JAPANESE JOURNAL OF APPLIED PHYSICS
(2020)
Article
Engineering, Electrical & Electronic
Hiromichi Wakebe, Takafumi Fukushima, Tetsu Tanaka
Summary: This study demonstrates a fabrication technique of SU-8 microchannel suitable for microfluidic-based BLM formation and successfully forms BLMs, which is of great significance for drug targets and biosensing applications.
ELECTRONICS AND COMMUNICATIONS IN JAPAN
(2022)
Article
Engineering, Electrical & Electronic
Yuki Miwa, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
Summary: This study explores the use of transparent recording electrodes to enhance the performance of neural probes for optogenetics, using ZnO-based materials with good biocompatibility and transparency for potential application in biomedical devices.
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B
(2022)
Article
Engineering, Electrical & Electronic
Hisashi Kino, Takafumi Fukusima, Tetsu Tanaka
IEEE JOURNAL OF THE ELECTRON DEVICES SOCIETY
(2019)
Proceedings Paper
Engineering, Electrical & Electronic
M. Murugesan, T. Fukushima, K. Mori, A. Nakamura, Y. Lee, M. Motoyoshi, J. C. Bea, S. Watariguchi, M. Koyanagi
2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)
(2019)
Proceedings Paper
Engineering, Electrical & Electronic
Yuki Susumago, Qian Zhengyang, Achille Jacquemond, Noriyuki Takahashi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima
2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)
(2019)
Proceedings Paper
Engineering, Electrical & Electronic
M. Murugesan, T. Fukushima, M. Koyanagi
2019 30TH ANNUAL SEMI ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE (ASMC)
(2019)
Proceedings Paper
Engineering, Electrical & Electronic
Yuki Susumago, Achille Jacquemond, Noriyuki Takahashi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima
2019 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP 2019)
(2019)
Article
Engineering, Electrical & Electronic
Young-Taek Oh, Jae-Min Sim, Hisashi Kino, Deok-Kee Kim, Tetsu Tanaka, Yun-Heub Song
IEEE JOURNAL OF THE ELECTRON DEVICES SOCIETY
(2019)