A study on the influence of local doping in atomic layer deposited Al:ZnO thin film transistors

Local doping of Al:ZnO into a ZnO matrix was performed vertically at various positions in a thin film using atomic layer deposition, and its influence was investigated by analyzing thin film transistor (TFT) characteristics. The position specific dopant distribution in the films was confirmed by high resolution transmission electron microscopy. It was found that doping specific locations in the active channel layer of a TFT had a different impact on its electrical characteristics. When near the semiconductor/gate dielectric interface, doping had a significant impact on the mobility of the TFT devices, which showed a gradual recovery as the doped region was moved away from the interface. The original characteristics of the device were almost completely restored once the doped region was moved more than 15 nm away from the interface, and when moved further away the output characteristics portrayed a shift in threshold voltage while preserving all other electrical characteristics. Various doping concentrations were implemented in regions both near and far away from the interface to gain a better understanding of the phenomena. The experimental results given here imply that the geographical position of doping is as important as selecting a dopant material in the device optimization of TFTs.