Kerf-Less Removal of Si, Ge, and III–V Layers by Controlled Spalling to Enable Low-Cost PV Technologies

出版年份 2012 全文链接

标题

作者

关键词

出版物

Volume 2, Issue 2, Pages 141-147

出版商

Institute of Electrical and Electronics Engineers (IEEE)

发表日期

2012-02-23

DOI

10.1109/jphotov.2012.2184267

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