The use of polyimide-modified aluminum nitride fillers in AlN@PI/Epoxy composites with enhanced thermal conductivity for electronic encapsulation
出版年份 2014 全文链接
标题
The use of polyimide-modified aluminum nitride fillers in AlN@PI/Epoxy composites with enhanced thermal conductivity for electronic encapsulation
作者
关键词
-
出版物
Scientific Reports
Volume 4, Issue 1, Pages -
出版商
Springer Nature
发表日期
2014-04-24
DOI
10.1038/srep04779
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