4.6 Article

Benzocyclobutene resin with fluorene backbone: a novel thermosetting material with high thermostability and low dielectric constant

期刊

RSC ADVANCES
卷 4, 期 75, 页码 39884-39888

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ROYAL SOC CHEMISTRY
DOI: 10.1039/c4ra05898d

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  1. Ministry of Science and Technology of China [2011ZX02703]
  2. Natural Science Foundation of China (NSFC) [21374131]

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A fluorene-based monomer (FB) with thermally cross-linkable benzocyclobutene groups is reported here. This monomer showed good solubility in the common organic solvents and had a low melting point (128 degrees C). When being treated at high temperature (>200 degrees C), the monomer was converted to a crosslinked network structure (PFB). TGA data exhibited that PFB had high thermostability with a 5% weight loss temperature of 437 degrees C and 372 degrees C in N-2 and air, respectively. Moreover, PFB showed a char yield of 47.6% at 1000 degrees C in N-2. With regard to the electrical properties, PFB indicated an average of dielectric constants of about 2.7 ranging from 0.15 MHz to 30 MHz. All these results suggest that FB could be used as the varnish for insulating enameled wire in the electrical industry, and as encapsulation resins in the microelectronics industry.

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