Thermo and Dynamic Mechanical Properties of the High Refractive Index Silicone Resin for Light Emitting Diode Packaging

标题
Thermo and Dynamic Mechanical Properties of the High Refractive Index Silicone Resin for Light Emitting Diode Packaging
作者
关键词
-
出版商
Institute of Electrical and Electronics Engineers (IEEE)
发表日期
2014-01-31
DOI
10.1109/tcpmt.2013.2292541

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