Through-Silicon Hole Interposers for 3-D IC Integration

标题
Through-Silicon Hole Interposers for 3-D IC Integration
作者
关键词
-
出版商
Institute of Electrical and Electronics Engineers (IEEE)
发表日期
2014-08-14
DOI
10.1109/tcpmt.2014.2339832

向作者/读者发起求助以获取更多资源

Become a Peeref-certified reviewer

The Peeref Institute provides free reviewer training that teaches the core competencies of the academic peer review process.

Get Started

Ask a Question. Answer a Question.

Quickly pose questions to the entire community. Debate answers and get clarity on the most important issues facing researchers.

Get Started