期刊
WASTE MANAGEMENT & RESEARCH
卷 29, 期 7, 页码 677-685出版社
SAGE PUBLICATIONS LTD
DOI: 10.1177/0734242X10380995
关键词
Recycling; recovery; integrated circuit; metal; gold; silver; copper
资金
- National Science Foundation of the Republic of China [NSC90-2211-E-212-005]
In order to minimize the problem of pollution and to conserve limited natural resources, a method to recover the valuable metals such as gold, silver and copper) present in the scrap integrated circuits (ICs) was developed in the present study. Roasting, grinding, screening, magnetic separation, melting and leaching were adopted to investigate the efficiency of recovery of gold, silver and copper from scrap ICs. The collected scrap IC samples were roasted at 850 degrees C to destroy their plastic resin sealing material, followed by screening and magnetic separation to separate the metals from the resin residue. The nonferrous materials (0.840 mm) were mainly composed of copper and could be melted into a copper alloy. Non-ferrous materials containing gold (860.05 ppm), silver (1323.12 ppm) and copper (37259.7 ppm) (size less than 50 mesh) were recovered 100% by a leaching process and thiourea was used as a leaching reagent.
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