Microstructure and deposition mechanism of electrodeposited Cu/liquid microcapsule composite

标题
Microstructure and deposition mechanism of electrodeposited Cu/liquid microcapsule composite
作者
关键词
-
出版物
TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA
Volume 21, Issue 10, Pages 2210-2215
出版商
Elsevier BV
发表日期
2011-11-12
DOI
10.1016/s1003-6326(11)60997-7

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