期刊
THEORETICAL AND APPLIED FRACTURE MECHANICS
卷 69, 期 -, 页码 80-89出版社
ELSEVIER SCIENCE BV
DOI: 10.1016/j.tafmec.2013.11.002
关键词
Single crystal; In situ SEM; Fatigue small crack; Crystallographic analysis
资金
- Siemens Power Generation
- National Natural Science Foundation of China [51071094, 10872105]
Small fatigue crack growth behaviors of a nickel-base single crystal (SX) are studied by in situ observations with scanning electron microscope (SEM). Two different crack propagation modes are identified, i.e., cracks at room temperature and 300 degrees C prefer non-crystallographic propagation mode, while those at a higher temperature of 600 degrees C propagate preferentially along crystallographic slip systems, besides, evident small crack anomaly has been partly found. Further computation of crack growth rate reveals that conventional Paris law is found no longer capable of characterizing the crystallographic crack propagation behaviors. Subsequently, with the help of finite element analysis (FEA), the crack tip stress fields are reconstructed and resolved shear stresses in each octahedral slip systems are calculated. It is found that the maximum resolved shear stress intensity parameter, first proposed by Chen and Liu, is able to characterize the growth behaviors of those small cracks. (C) 2013 Elsevier Ltd. All rights reserved.
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