Electrodeposition, structural, and corrosion properties of Cu films from a stable deep eutectics system with additive of ethylene diamine

出版年份 2012 全文链接

标题

作者

关键词

出版物

Volume 209, Issue -, Pages 117-123

出版商

Elsevier BV

发表日期

2012-08-27

DOI

10.1016/j.surfcoat.2012.08.047

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