Electronic and crystal structure and bonding in Ti-based ternary solid solution nitrides and Ti–Cu–N nanocomposite films

出版年份 2010 全文链接

标题

作者

关键词

出版物

Volume 205, Issue 5, Pages 1324-1330

出版商

Elsevier BV

发表日期

2010-09-18

DOI

10.1016/j.surfcoat.2010.09.024

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