Wirebond crosstalk and cavity modes in large chip mounts for superconducting qubits

标题
Wirebond crosstalk and cavity modes in large chip mounts for superconducting qubits
作者
关键词
-
出版物
SUPERCONDUCTOR SCIENCE & TECHNOLOGY
Volume 24, Issue 6, Pages 065001
出版商
IOP Publishing
发表日期
2011-03-26
DOI
10.1088/0953-2048/24/6/065001

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