4.3 Article

Temperature impact on the tunnel fet off-state current components

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SOLID-STATE ELECTRONICS
卷 78, 期 -, 页码 141-146

出版社

PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.sse.2012.05.053

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Triple gate SOI tunnel FETs; Off-state current components; Temperature; Ambipolar behavior; SRH; TAT

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In this work, the temperature impact on the off-state current components is analyzed through numerical simulation and experimentally. First of all, the band-to-band tunneling is studied by varying the underlap in the channel/drain junction, leading to an analysis of the different off-state current components. For pTFET devices, the best behavior for off-state current was obtained for higher values of underlap (reduced BTBT) and at low temperatures (reduced SRH and TAT). At high temperature, an unexpected off-state current occurred due to the thermal leakage current through the drain/channel junction. Besides, these devices presented a good performance when considering the drain current as a function of the drain voltage, making them suitable for analog applications. (C) 2012 Elsevier Ltd. All rights reserved.

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