Development of highly-sensitive and ultra-thin silicon stress sensor chips for wearable biomedical applications

出版年份 2014 全文链接

标题

Development of highly-sensitive and ultra-thin silicon stress sensor chips for wearable biomedical applications

作者

关键词

-

出版物

SENSORS AND ACTUATORS A-PHYSICAL

Volume 216, Issue -, Pages 158-166

出版商

Elsevier BV

发表日期

2014-05-28

DOI

10.1016/j.sna.2014.05.018

向作者/读者发起求助以获取更多资源

Protocol

Reagent

Reprint

Find Funding. Review Successful Grants.

Explore over 25,000 new funding opportunities and over 6,000,000 successful grants.

Explore

Discover Peeref hubs

Discuss science. Find collaborators. Network.

Join a conversation

© Peeref 2019-2024. All rights reserved.