Void control in adhesive bonding using thermosetting polymer

标题
Void control in adhesive bonding using thermosetting polymer
作者
关键词
-
出版物
SENSORS AND ACTUATORS A-PHYSICAL
Volume 167, Issue 2, Pages 398-405
出版商
Elsevier BV
发表日期
2011-04-15
DOI
10.1016/j.sna.2011.03.028

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