A wafer-scale etching technique for high aspect ratio implantable MEMS structures

标题
A wafer-scale etching technique for high aspect ratio implantable MEMS structures
作者
关键词
-
出版物
SENSORS AND ACTUATORS A-PHYSICAL
Volume 162, Issue 1, Pages 130-136
出版商
Elsevier BV
发表日期
2010-06-14
DOI
10.1016/j.sna.2010.06.011

向作者/读者发起求助以获取更多资源

Add your recorded webinar

Do you already have a recorded webinar? Grow your audience and get more views by easily listing your recording on Peeref.

Upload Now

Become a Peeref-certified reviewer

The Peeref Institute provides free reviewer training that teaches the core competencies of the academic peer review process.

Get Started