Optimization and characterization of wafer-level adhesive bonding with patterned dry-film photoresist for 3D MEMS integration

标题
Optimization and characterization of wafer-level adhesive bonding with patterned dry-film photoresist for 3D MEMS integration
作者
关键词
-
出版物
SENSORS AND ACTUATORS A-PHYSICAL
Volume 162, Issue 1, Pages 137-144
出版商
Elsevier BV
发表日期
2010-06-17
DOI
10.1016/j.sna.2010.06.008

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