期刊
SENSORS AND ACTUATORS A-PHYSICAL
卷 145, 期 -, 页码 306-315出版社
ELSEVIER SCIENCE SA
DOI: 10.1016/j.sna.2007.10.053
关键词
parylene-C; flexible shadow masks; high aspect ratio polymer etching
资金
- Directorate For Engineering
- Div Of Engineering Education and Centers [832785] Funding Source: National Science Foundation
In this paper, we present a low cost, flexible and reusable parylene-C shadow mask technology for diverse micropatterning applications. The smallest feature size of 4 mu m is demonstrated and the technology is scalable up to full wafer scale. With the addition of SU-8 pillars, we also demonstrate multimask processing with an alignment accuracy of about 4-9 mu m. To achieve features with fine resolution, a low temperature and high aspect ratio (>8: 1) parylene etch process is also developed. Utilizing this shadow mask, we successfully patterned proteins and cells on various surfaces (glass, PDMS, methacrylate). High pattern flexibility (structures with different shapes and dimensions are successfully patterned) and patterning on curved PDMS surfaces are also demonstrated. This technology has potential applications for patterning proteins, cells and organic transistors on conventional and/or unconventional substrates. (C) 2007 Elsevier B.V. All rights reserved.
作者
我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。
推荐
暂无数据