Defect Inspection of Flip Chip Solder Bumps Using an Ultrasonic Transducer

Board-Level Functional Fault Diagnosis Using Artificial Neural Networks, Support-Vector Machines, and Weighted-Majority Voting

(2013) Fangming Ye et al.   IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS

Using BP network for ultrasonic inspection of flip chip solder joints

(2012) Lei Su et al.   MECHANICAL SYSTEMS AND SIGNAL PROCESSING

A novel approach for flip chip solder joint inspection based on pulsed phase thermography

(2011) Xiangning Lu et al.   NDT & E INTERNATIONAL

Ultrasonic Array for Obstacle Detection Based on CDMA with Kasami Codes

(2011) Cristina Diego et al.   SENSORS

Sparse signal representation and its applications in ultrasonic NDE

(2011) Guang-Ming Zhang et al.   ULTRASONICS

Automated inspection and classification of flip-chip-contacts using scanning acoustic microscopy

(2010) S. Brand et al.   MICROELECTRONICS RELIABILITY

A Neurofuzzy Method for the Evaluation of Soldering Global Quality Index

(2009) A. Giaquinto et al.   IEEE Transactions on Industrial Informatics

Effects of soft beam energy on the microstructure of Pb37Sn, Au20Sn, and Sn3.5Ag0.5Cu solder joints in lensed-SM-fiber to laser-diode-affixing application

(2007) C.W. Tan et al.   OPTICS AND LASERS IN ENGINEERING