4.6 Article

A Low-Cost CMOS-MEMS Piezoresistive Accelerometer with Large Proof Mass

期刊

SENSORS
卷 11, 期 8, 页码 7892-7907

出版社

MDPI
DOI: 10.3390/s110807892

关键词

CMOS-MEMS; piezoresistive; polysilicon; deep reactive ion etching (DRIE)

资金

  1. Directorate For Engineering
  2. Div Of Electrical, Commun & Cyber Sys [1040304] Funding Source: National Science Foundation

向作者/读者索取更多资源

This paper reports a low-cost, high-sensitivity CMOS-MEMS piezoresistive accelerometer with large proof mass. In the device fabricated using ON Semiconductor 0.5 mu m CMOS technology, an inherent CMOS polysilicon thin film is utilized as the piezoresistive sensing material. A full Wheatstone bridge was constructed through easy wiring allowed by the three metal layers in the 0.5 mu m CMOS technology. The device fabrication process consisted of a standard CMOS process for sensor configuration, and a deep reactive ion etching (DRIE) based post-CMOS microfabrication for MEMS structure release. A bulk single-crystal silicon (SCS) substrate is included in the proof mass to increase sensor sensitivity. In device design and analysis, the self heating of the polysilicon piezoresistors and its effect to the sensor performance is also discussed. With a low operating power of 1.5 mW, the accelerometer demonstrates a sensitivity of 0.077 mV/g prior to any amplification. Dynamic tests have been conducted with a high-end commercial calibrating accelerometer as reference.

作者

我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。

评论

主要评分

4.6
评分不足

次要评分

新颖性
-
重要性
-
科学严谨性
-
评价这篇论文

推荐

暂无数据
暂无数据