Productionisation issues for commercialisation of microfluidic based devices

Purpose - Microfluidic or lab-on-a-chip technology is seen as a key enabler in the rapidly expanding market for medical point-of-care and other kinds of portable diagnostic device. The purpose of this paper is to discuss two proposed packaging processes for large-scale manufacture of microfluiclic systems. Design/methodology/approach - In the first packaging process, polymer overmoulding of a microfluidic chip is used to form a fluidic manifold integrated with the device in a single step. The anticipated advantages of the proposed method of packaging are ease of assembly and low part count. The second process involves the use of low-frequency induction heating (LFIH) for the sealing of polymer microfluidics. The method requires no chamber, and provides fast and selective heating to the interface to be joined. Findings - Initial work with glass microfluidics demonstrates feasibility for overmoulding through two separate sealing principles. One uses the overmould as a physical support structure and providing sealing using a compliant ferrule. The other relies on adhesion between the material of the overmould and the microfluidic device to provide a seal. As regards LFIH work on selection and structuring of susceptor materials is reported, together with analysis of the dimensions of the heat-affected zone. Acrylic plates are joined using a thin (<10 mu m) nickel susceptor providing a fluid seal that withstands a pressure of 590 kPa. Originality/value - Microfluiclic chips have until now been produced in relatively small numbers. To scale-up from laboratory systems to the production volumes required for mass markets, packaging methods need to be adapted to mass manufacture.