Photolithography-free fabrication of organic light-emitting diodes for lighting applications

We investigate the photolithography-free fabrication of organic light-emitting diodes (OLEDs) for lighting applications with an attempt to embed the deposition and patterning process of an indium-tin-oxide (ITO) anode and insulating layer into an in-line-type organic evaporation system. This scheme inevitably brings in leakage current induced by the spike-like surface of ITO. To suppress it, we cover the ITO edges with three different insulation materials (i.e. sputter-deposited inorganic Al2O3 thin film, monomer (polymer) thin film deposited by organic acrylate evaporation or thermally evaporated organic insulation layer (tris-(8-hydroxyquinoline) aluminum (Alq(3)))). Although small-molecule organic insulation materials that can be thermally evaporated are the most suitable for such a cost-effective fabrication process, yet their insulation capability is low due to the carrier transporting property. In this paper, we demonstrate that it can be boosted to a great extent with an increase of their thickness. It is likely that pinholes existing on the Al2O3 thin film act as leak channels, degrading the device performance. We also verify that the insulation capability of polymer fabricated by organic acrylate evaporation is just comparable with that of polyimide (PI) insulator patterned using a standard photolithography process.