Finite element analysis of deflection and residual stress on machined ultra-thin silicon wafers

出版年份 2011 全文链接

标题

Finite element analysis of deflection and residual stress on machined ultra-thin silicon wafers

作者

关键词

-

出版物

SEMICONDUCTOR SCIENCE AND TECHNOLOGY

Volume 26, Issue 10, Pages 105002

出版商

IOP Publishing

发表日期

2011-08-31

DOI

10.1088/0268-1242/26/10/105002

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