Interface-facilitated deformation twinning in copper within submicron Ag–Cu multilayered composites

标题
Interface-facilitated deformation twinning in copper within submicron Ag–Cu multilayered composites
作者
关键词
-
出版物
SCRIPTA MATERIALIA
Volume 64, Issue 12, Pages 1083-1086
出版商
Elsevier BV
发表日期
2011-03-02
DOI
10.1016/j.scriptamat.2011.02.025

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