Orientation dependence of void formation and substructure deformation in a spalled copper bicrystal

While numerous investigations have examined microstructural, substructural and damage evolution due to shock loading, few of these studies have directly linked substructural evolution as a function of crystallographic orientation with nucleation of damage during shock loading. In this work, quantitative characterization of damage and substructural evolution in bicrystal copper reveals that the density of dislocation cells based on activation of available slip systems due to Schmid factor analysis influences damage nucleation in copper. Published by Elsevier Ltd. on behalf of Acta Materialia Inc.