Electrodeposition mechanism of nickel films on polycrystalline copper from dilute simple sulphate solutions

标题
Electrodeposition mechanism of nickel films on polycrystalline copper from dilute simple sulphate solutions
作者
关键词
-
出版物
RUSSIAN JOURNAL OF ELECTROCHEMISTRY
Volume 47, Issue 7, Pages 787-792
出版商
Pleiades Publishing Ltd
发表日期
2011-07-13
DOI
10.1134/s1023193511070159

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