Article
Chemistry, Applied
ZeKun Zhao, Jun Wang, Jingsheng Wang, Kaiwen Chen, Bin Zhang, Qiufei Chen, Pengzong Guo, Xiao Wang, Fu Liu, Siqi Huo, Shuang Yang
Summary: By incorporating DOPO, BDM and BICP into the EP system, a novel single-component EP system containing phosphorus and nitrogen was successfully synthesized. The results showed that the addition of BDM improved the thermal stability, flame retardancy and smoke suppression of EP/DOPO/BDM/BICP.
REACTIVE & FUNCTIONAL POLYMERS
(2022)
Article
Thermodynamics
Dharmesh B. Sankhavara, Jalpa V. Chopda, Jignesh P. Patel, Parsotam H. Parsania
Summary: The chalcone moiety epoxy resin EBHBC was cured using different hardeners, resulting in different gel and sol fractions in sol-gel analysis. The cured resins showed variations in thermal stability, residues, and degradation kinetics depending on the aromatic diamines and anhydrides used in the curing process.
JOURNAL OF THERMAL ANALYSIS AND CALORIMETRY
(2021)
Article
Materials Science, Composites
Mengying Li, Jun Xiao, Xingbang Wang, Xiao Yang, Xiaodong Chen
Summary: A high-performance compound epoxy resin system suitable for wet filament winding was designed with improved properties. Through comparing the curing behavior of thermal and microwave curing composites, it was found that microwave curing exhibited higher curing degree and reaction rate in the early and middle stages. However, in the later stages of curing, the difference between the two methods was minimal.
POLYMER COMPOSITES
(2021)
Article
Chemistry, Applied
Wanjing Liu, Pan Tian, Yisen Huang, Junhua Zhang
Summary: In this paper, a new UV-light-sensitive solid resist resin with high glass transition temperature, high double-bond conversion and low dielectric constant was successfully synthesized by using cholic acid to react with epoxy resin. It shows promising application potential for light-curing inks in high-frequency electronic packaging.
PROGRESS IN ORGANIC COATINGS
(2022)
Article
Polymer Science
Dharmalingam Sivanesan, BongKuk Seo, Choong-Sun Lim, Suna Kim, Hyeon-Gook Kim
Summary: This study reports the synthesis of thermoset polymers from trifunctional cyclohexylepoxide (CHE) and investigates their thermal stabilities and properties with different curing agents and reaction conditions. The CHE/IM system demonstrates varying thermal stabilities, while the CHE/DDM cured system shows the best thermal mechanical properties among all tested formulations. Activation energies for polymerization reactions are calculated to understand and compare the polymerization of CHE with different curing agents, in comparison with commercially available DGEBA and DGGHA epoxy/amine polymers.
Article
Materials Science, Multidisciplinary
Zhigang Yuan, Lei Wang, Mingming Sun, Xugang Zhang, Mehdi Derradji, Bin Zhang, Jianhui Li, Gang Xue, Ming Zhao, Caizhao Liu
Summary: A newly developed vanillin-derived diene compound (TFBAM) incorporated with epoxy resin (E51) was studied for its enhancement of thermal, dielectric, and mechanical properties. Results showed that an appropriate concentration of TFBAM could improve the thermal stability and dielectric properties of the epoxy resin without damaging its mechanical properties. This research is essential for expanding the application of epoxy resins in high-end fields.
MATERIALS TODAY COMMUNICATIONS
(2023)
Article
Thermodynamics
Linhai Zhang, Pingfa Feng, Jie Xu, Yu Li, Wang Gao, Guiqiang Liang, Feng Feng
Summary: In this study, a piecewise model was proposed to address the systematic errors of existing curing kinetic models in actual curing cycles. Dynamic and isothermal models were developed based on DSC data, and then applied to establish the piecewise model. The proposed model showed significantly lower prediction error compared to existing models, and demonstrated favorable universality for numerical simulation and parameter optimization.
JOURNAL OF THERMAL ANALYSIS AND CALORIMETRY
(2023)
Article
Polymer Science
Dan Qian, Jiahai Zhou, Jieyuan Zheng, Jun Cao, Jintao Wan, Hong Fan
Summary: In this study, a new silicone-modified trifunctional epoxy monomer SITEUP was synthesized and successfully improved the toughness of epoxy. The modified epoxy thermosets showed increased impact strength, flexural strength, thermal stability, and damping characteristics. In addition, SITEUP also improved the surface properties of epoxy materials.
Article
Engineering, Environmental
Qiangsheng Sun, Yudi Feng, Jia Guo, Changchun Wang
Summary: Researchers have designed and synthesized a new conformation-switchable curing agent that can control the coefficient of thermal expansion (CTE) of epoxy resins from negative to positive. The agent has been proven effective through theoretical calculations and experimental results, and commercial epoxy resins cured with it exhibit low CTE and improved mechanical properties.
CHEMICAL ENGINEERING JOURNAL
(2022)
Article
Polymer Science
Jiachen Wang, Wei Liu, Huan Liu, Xiaodong Wang, Dezhen Wu, Shuangkun Zhang, Shaowei Shi, Weiwei Liu, Zhanpeng Wu
Summary: A novel epoxy monomer, CP-EP, composed of nontoxic eugenol and nonflammable cyclotriphosphazene, was successfully synthesized in this work. The resulting cyclotriphosphazene-based thermosets (CPTs) exhibited improved properties compared to bisphenol-A epoxy resin, including higher glass transition temperature, enhanced mechanical strengths, and enhanced nonflammability. The use of this environmentally friendly and fire-safe epoxy thermosetting system has the potential to benefit both the environment and human health.
Article
Polymer Science
Hongli Jia, Yingdan Zhu, Chun Yan, Mingda Chen, Gang Chen, Dong Liu
Summary: A new method is developed in this paper to improve the accuracy of fitting models by specifying the initial curing degree, and the curing kinetics of various resin systems are examined and compared. The results show that the utilization of initial curing degree promotes the accuracy of fitting models.
JOURNAL OF APPLIED POLYMER SCIENCE
(2023)
Article
Chemistry, Multidisciplinary
Wei-Hua Xu, Shi-Jing Yan, Jian-Qing Zhao
Summary: POSS and DOPO-based flame retardant co-curing agent were introduced into DDM/DGEBA epoxy system, creating organic-inorganic hybrid epoxy composites with improved flame retardancy and mechanical properties.
Article
Computer Science, Information Systems
Kaiyi Tian, Senyuan Yang, Jiaxuan Niu, Hanxiang Wang
Summary: Epoxy resin, widely used for its electrical insulation performances, faces limitations in low elongation defects, low thermal conductivity, and high brittleness. Utilizing mesogen in the form of Biphenyl Liquid Crystal Epoxy Resin (BLCER) to improve the traditional epoxy resin, this study shows significant improvements in impact strength, tensile strength, bending strength, and thermal conductivity. Mesogen incorporation leads to enhanced mechanical toughness and thermal conductivity, offering a potential for a variety of properties in epoxy resin without compromising its original performance.
Article
Polymer Science
Dong Ni, Yan Luo, Yuxiang Cong
Summary: The study successfully encapsulated multi-polyaniline (MPAN) using microencapsulation to extend the storage life of epoxy adhesives, showing potential industrial applications.
JOURNAL OF APPLIED POLYMER SCIENCE
(2021)
Article
Chemistry, Analytical
Hongyu Dong, Huiming Liu, Arata Nishimura, Zhixiong Wu, Hengcheng Zhang, Yemao Han, Tao Wang, Yongguang Wang, Chuanjun Huang, Laifeng Li
Summary: This study presents a monitoring system for real-time strain response during the curing process of epoxy resin, showing the significant influence of curing process and temperature changes on strain behavior. The curing process affects the residual strain and mechanical properties of epoxy resin, while curing temperature has an impact on the impact strength of the resin.
