Hygroscopic and thermal micro deformations of plastic substrates for flexible electronics using digital image correlation

标题
Hygroscopic and thermal micro deformations of plastic substrates for flexible electronics using digital image correlation
作者
关键词
-
出版物
POLYMER TESTING
Volume 30, Issue 2, Pages 188-194
出版商
Elsevier BV
发表日期
2010-12-02
DOI
10.1016/j.polymertesting.2010.11.012

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