期刊
POLYMER TESTING
卷 29, 期 6, 页码 723-728出版社
ELSEVIER SCI LTD
DOI: 10.1016/j.polymertesting.2010.05.008
关键词
Thermoset; Melamine; Phenol; Moulding compound; Cross-linking; DSC
Commercially available melamine/phenolic (MP) moulding compounds used for manufacturing electro installation parts were investigated by laboratory thermal analysis methods: Dynamic Mechanical Analysis (DMA), Differential Scanning Calorimetry (DSC) and Dielectric Analysis (DEA). The results were compared with on-line measurements in a compression mould using incorporated dielectric and ultrasound sensors. Softening and cross-linking behaviour were analyzed. For on-line process monitoring, only the ultrasound method worked well. The dielectric method was distorted by water formed as a by-product from the poly-condensation reaction. (C) 2010 Elsevier Ltd. All rights reserved.
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