4.7 Article

Incorporating the CALPHAD sublattice approach of ordering into the phase-field model with finite interface dissipation

期刊

ACTA MATERIALIA
卷 88, 期 -, 页码 156-169

出版社

PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.actamat.2014.11.037

关键词

Phase-field model; Computational thermodynamics; Kinetics of phase transformations; CALPHAD modelling

资金

  1. Alexander von Humboldt Foundation, Bonn, Germany
  2. National Natural Science Foundation of China [51301208, 51474239]
  3. Shenghua Scholar Program of Central South University, Changsha, P.R. China
  4. National Basic Research Program of China [2011CB610401, 2014CB644002]
  5. Alexander von Humboldt Foundation
  6. Sino-German cooperation group Microstructure in A1 alloys [GZ755]
  7. Sino-German Center for Promotion of Science
  8. National Nature Science Foundation of China
  9. German Science Foundation (DFG)
  10. collaborative research centre [SFB-TR 103]

向作者/读者索取更多资源

A new approach to incorporate the sublattice models in the CALPHAD (CALculation of PHAse Diagram) formalism directly into the phase-field formalism is developed. In binary alloys, the sublattice models can be classified into two types (i.e., Type I and Type II), depending on whether a direct one-to-one relation between the element site fraction in the CALPHAD database and the phase concentration in the phase-field model exists (Type I), or not (Type II). For Type II sublattice models, the specific site fractions, corresponding to a given mole fraction, have to be established via internal relaxation between different sublattices. Internal minimization of sublattice occupancy and solute evolution during microstructure transformation leads, in general, to a solution superior to the separate solution of the individual problems. The present coupling technique is validated for Fe-C and Ni-Al alloys. Finally, the model is extended into multicomponent alloys and applied to simulate the nucleation process of VC monocarbide from austenite matrix in a steel containing vanadium. (c) 2014 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

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