期刊
TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING
卷 93, 期 1, 页码 18-23出版社
MANEY PUBLISHING
DOI: 10.1179/0020296714Z.000000000217
关键词
Aluminium; Copper; Anodising sulphuric acid; Anodic films; Ion beam analysis
资金
- Engineering and Physical Sciences Research Council (UK)
- British Spanish Society
- European Community [227012]
- Ramon y Cajal Fellowship [RYC-2010-06749]
- EPSRC [EP/H020047/1] Funding Source: UKRI
- Engineering and Physical Sciences Research Council [EP/H020047/1] Funding Source: researchfish
The effect of copper on anodising of aluminium in sulphuric acid at low potentials has been examined for a sputtering-deposited Al-0.75 at.-%Cu alloy, using ion beam analysis and transmission electron microscopy. The aim was to determine the relationship between the potential and oxygen generation, with copper in the anodic film in either a metallic or oxidised form. The findings revealed that similar to 30 to 40% of the cell charge is used in oxygen generation at potentials between 2 and 8 V( SCE). The charge of Al3+ ions in the film indicated overall efficiencies of film growth that increased from 23 to 41% over the potential range.
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