Factor analysis of responses to thermal, electrical, and mechanical painful stimuli supports the importance of multi-modal pain assessment

出版年份 2011 全文链接

标题

作者

关键词

出版物

Volume 152, Issue 5, Pages 1146-1155

出版商

Ovid Technologies (Wolters Kluwer Health)

发表日期

2011-03-11

DOI

10.1016/j.pain.2011.01.047

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