High precision processing of flexible P3HT/PCBM modules with geometric fill factor over 95%

标题
High precision processing of flexible P3HT/PCBM modules with geometric fill factor over 95%
作者
关键词
-
出版物
ORGANIC ELECTRONICS
Volume 15, Issue 10, Pages 2256-2263
出版商
Elsevier BV
发表日期
2014-06-26
DOI
10.1016/j.orgel.2014.06.006

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