期刊
OPTICS EXPRESS
卷 19, 期 3, 页码 2335-2346出版社
OPTICAL SOC AMER
DOI: 10.1364/OE.19.002335
关键词
-
类别
资金
- DARPA [W911NF-06-1-0449, W911NF-08-1-0362]
- Div Of Electrical, Commun & Cyber Sys
- Directorate For Engineering [0844994] Funding Source: National Science Foundation
We demonstrate a monolithic photonic integration platform that leverages the existing state-of-the-art CMOS foundry infrastructure. In our approach, proven XeF(2) post-processing technology and compliance with electronic foundry process flows eliminate the need for specialized substrates or wafer bonding. This approach enables intimate integration of large numbers of nanophotonic devices alongside high-density, high-performance transistors at low initial and incremental cost. We demonstrate this platform by presenting grating-coupled, microring-resonator filter banks fabricated in an unmodified 28 nm bulk-CMOS process by sharing a mask set with standard electronic projects. The lithographic fidelity of this process enables the high-throughput fabrication of second-order, wavelength-division-multiplexing (WDM) filter banks that achieve low insertion loss without post-fabrication trimming. (C)2010 Optical Society of America
作者
我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。
推荐
暂无数据