Novel 3D Biscuit-like CuO Fabricated via a Simple Thermal Decomposition Process

Biscuit-like CuO have been prepared via a thermal decomposition reaction of CuC2O4 at 300-500oC for 1h. The morphology and structure of the synthesized biscuit-like structures were characterized by X-ray diffraction, field emission scanning electron microscope, transmission electron microscope, and Fourier transform infrared spectroscopy. The results show that these biscuit-like CuO presents monoclinic structure and typical diameters of 1.0-2.0 mu m with a self-assembly of nanocrystals, which average diameter was about 25nm. The as-prepared CuO nanostructure has a high surface area of about 82.71m(2)/g. Finally, a possible growth mechanism was also proposed to explain the formation of biscuit-like CuO.